September 28, 2006 -- In-home powerline communications start-up SiConnect announced that it has received first-time working silicon for its first powerline transceiver from the foundry, and is ready to start benchmarking the device. The news coincides with the announcement of a further investment in the company of £2.8 million from existing investors Esprit Capital Partners, TTP Ventures, and Dow Venture Capital.
Targeting a range of in-home audio/video applications, including the distribution of triple play services, SiConnect says it is now on course to be sampling its first product during Q4 of 2006, moving to volume availability in Q1 of 2007. The company selected Chartered Semiconductor's 0.18-micron HV CMOS process for its first chip implementation and Unisem for die packaging.
Introduced earlier this year, SiConnect's POEM technology is designed to bring a range of benefits to powerline communications applications, including managed QoS, a plug-and-play user experience, privacy protection, compliance with global EMC regulations, and a $5 chip price.
SiConnect's VP of engineering, Paul Nickson comments, "POEM technology provides an incredible amount of leading-edge functionality and implementing it in what is a highly reliable and mature process has proven to be the right route for us to take, both in terms of quality and cycle time. We have been delighted with our partnership with Chartered Semiconductor and Unisem in delivering first-time working silicon."
Russell Haggar of Esprit Capital Partners adds, "The investors are excited about SiConnect's prospects and are pleased to be able to support it by investing further in what is a trailblazing company that has very successfully produced its first chip. SiConnect now has the momentum and the resources with which to further develop its marketing, sales and customer support network and to launch a market-leading powerline communications product."
